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CEI CLC/TR 62258-7 : 2009

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2009

€104.52
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General
5 Data exchange
Annex A (normative) - XML schema
Annex B (informative) - XML example
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Aims to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-1032. (07/2015)
DocumentType
Standard
Pages
34
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
CLC/TR 62258-7:2007 Identical
IEC TR 62258-7:2007 Identical

EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

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