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  • CLC/TR 62258-7:2007

    Current The latest, up-to-date edition.

    Semiconductor die products - Part 7: XML schema for data exchange

    Available format(s): 

    Language(s): 

    Published date:  05-10-2007

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Definitions
    4 General
    5 Data exchange
    Annex A (normative) XML schema
    Annex B (informative) XML example
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 47
    Document Type Technical Report
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    BS EN 62258-1:2010 Semiconductor die products Procurement and use
    CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
    EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
    CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
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