CEI EN 60068-2-21 : 2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
Hardcopy , PDF
14-06-2022
English - Italian
01-01-2006
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1 Scope
2 Normative references
3 Test Ua[1]: tensile
4 Test Ua[2]: thrust
5 Test Ub: bending
6 Test Uc: torsion
7 Test Ud: torque
8 Test Ue: robustness of
terminations for SMD in
the mounted state
Bibliography
Annex ZA (normative) - Normative
references to international
publications with their
corresponding European
publications
Defines to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-40. (10/2006)
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| EN 60068-2-21:2006 | Identical |
| IEC 60068-2-21:2006 | Identical |
| ISO 272:1982 | Fasteners — Hexagon products — Widths across flats |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 60068-2-61:1991 | Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 29453 : 1993 | SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS |
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