Skip to content
Please enter a keyword to search

  • CEI EN 60068-2-21 : 2006

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
    View superseded by

    ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES

    Available format(s):  Hardcopy, PDF

    Superseded date:  13-06-2022

    Language(s):  English - Italian

    Published date:  31-12-2005

    Publisher:  Comitato Elettrotecnico Italiano

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Test Ua[1]: tensile
    4 Test Ua[2]: thrust
    5 Test Ub: bending
    6 Test Uc: torsion
    7 Test Ud: torque
    8 Test Ue: robustness of
      terminations for SMD in
      the mounted state
    Bibliography
    Annex ZA (normative) - Normative
             references to international
             publications with their
             corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Defines to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-40. (10/2006)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 272:1982 Fasteners — Hexagon products — Widths across flats
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 60068-2-61:1991 Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 29453 : 1993 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective