CEI EN 60191-6-12 : 2012
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
Hardcopy , PDF
English
01-06-2012
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
This Standard is part of the EN/IEC 60191 series concerning the mechanical sizing of semiconductor devices/components; In particular, it deals with the drawings of semiconductor components for surface mounting.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-91. (07/2012)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60191-6-12:2011 | Identical |
| IEC 60191-6-12:2011 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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