CEI EN 60191-6-19 : 2011
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
Hardcopy , PDF
English
01-01-2011
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Sample
5. Measurement
6. Maximum permissible package warpage at
elevated temperature
7. Recommended datasheet for the package
warpage
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-76. (11/2011)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-19:2010 | Identical |
| IEC 60191-6-19:2010 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60191-6-2:2002 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| IEC 60191-6-2:2001 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.