MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2014

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Terminal position numbering
5. Code of package nominal dimensions
6. Symbols and drawings
7. Dimensions
8. Combination list of D, E, MD, and ME
Bibliography

Describes the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-110. (03/2014)
DocumentType	Standard
Pages	22
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN 60191-6-22:2013	Identical
IEC 60191-6-22:2012	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-12:2011	Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
IEC 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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CEI EN 60191-6-22 : 2014

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory