CEI EN 60191-6-3 : 2001
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2001
Publisher
€47.63
Excluding VAT
Foreword
1 Scope
2 Normative references
3 Definitions
4 Measuring methods
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
This rule was implemented by the announcement on CEINFORMA in May 2001.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1003. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-3:2000 | Identical |
| IEC 60191-6-3:2000 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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