CEI EN 60191-6-4 : 2004

Current

Current The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

Available format(s): Hardcopy, PDF

Language(s): English

Published date: 01-01-2004

Publisher: Comitato Elettrotecnico Italiano

Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
5 Measuring method
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Abstract - (Show below) - (Hide below)

Provides the requirements for the measuring methods of ball grid array (BGA) dimensions.

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Committee	CT 309
Development Note	Classificazione CEI 47-1004. (07/2015)
Document Type	Standard
ISBN
Pages
Published
Publisher	Comitato Elettrotecnico Italiano
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 60191-6-4:2003	Identical
EN 60191-6-4:2003	Identical

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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