CEI EN 60191-6-5 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
Hardcopy , PDF
English
01-01-2002
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FOREWORD
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative)- Normative references to
International publications with their corresponding
European publications
Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1005. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-5:2001 | Identical |
| EN 60191-6-5:2001 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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