CEI EN 60749-8 : 2004
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING
Hardcopy , PDF
English
01-01-2004
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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
4 Bomb pressure test
5 Fine leak detection: radioactive
krypton method
6 Fine leak detection: tracer
gas (helium) method with
mass spectrometer
7 Gross leaks, perfluorocarbon
vapour method using electronic
detection apparatus
8 Gross leak - Perfluorocarbon - bubble
detection method
9 Test condition E, weight-gain
gross-leak detection
10 Penetrant dye gross leak detection
11 Gross leak re-test
Pertains to semiconductor devices (discrete devices and integrated circuits).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-36. (01/2005) Supersedes CEI EN 60749. (05/2008)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60749-8:2003 | Identical |
| IEC 60749-8:2002 | Identical |
| EN 60068-2-17:1994 | Environmental testing - Part 2: Tests - Test Q: Sealing |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
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