• CEI EN 60749-8 : 2004

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2004

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 General terms
    4 Bomb pressure test
    5 Fine leak detection: radioactive
       krypton method
    6 Fine leak detection: tracer
       gas (helium) method with
       mass spectrometer
    7 Gross leaks, perfluorocarbon
       vapour method using electronic
       detection apparatus
    8 Gross leak - Perfluorocarbon - bubble
       detection method
    9 Test condition E, weight-gain
       gross-leak detection
    10 Penetrant dye gross leak detection
    11 Gross leak re-test

    Abstract - (Show below) - (Hide below)

    Pertains to semiconductor devices (discrete devices and integrated circuits).

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    Committee CT 309
    Development Note Classificazione CEI 47-36. (01/2005) Supersedes CEI EN 60749. (05/2008)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
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