CEI EN 61760-4 : 2016
Current
The latest, up-to-date edition.
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
Hardcopy , PDF
English
01-01-2016
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General information
5 Assessment of moisture sensitivity
6 Test procedure
7 Requirements to packaging and labelling
8 Handling of moisture sensitive devices
9 Drying
Annex A (informative) - Moisture sensitivity of assemblies
Annex B (informative) - Mass/gain loss analysis
Annex C (informative) - Baking of devices
Annex D (normative) - Moisture sensitivity labels
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-79. (03/2016)
|
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61760-4:2015 | Identical |
| EN 61760-4:2015/A1:2018 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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