UNE-EN ISO 14644-9:2014
|
Cleanrooms and associated controlled environments - Part 9: Classification of surface cleanliness by particle concentration (ISO 14644-9:2012) |
08/30180398 DC : 0
|
BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
BS EN 61340-4-9:2016
|
Electrostatics Standard test methods for specific applications. Garments |
BS EN 61340-2-1:2015
|
Electrostatics Measurement methods. Ability of materials and products to dissipate static electric charge |
BS EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
13/30286159 DC : 0
|
BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
BS EN 62258-1:2010
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
13/30286167 DC : 0
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BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
BS EN 61340-5-3:2015
|
Electrostatics Protection of electronic devices from electrostatic phenomena. Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
S.R. CLC/TR 61340-5-2:2008
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ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
IEC TR 61340-5-2:2007
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
IEC TR 61340-5-2:2018 RLV
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
ISO/TS 19880-1:2016
|
Gaseous hydrogen Fuelling stations Part 1: General requirements |
CEI EN 61760-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61340-5-3:2015
|
ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES |
I.S. EN 62258-1:2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
BS EN 60747-16-3 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
I.S. EN 60679-1:2017
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
EN 60749-3:2017
|
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
EN 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
EN 62435-1:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
EN 61340-2-1:2015
|
Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge |
EN 62258-1:2010
|
Semiconductor die products - Part 1: Procurement and use |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
02/203838 DC : DRAFT MAR 2002
|
|
I.S. EN 61340-4-6:2015
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ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
DD IEC/TS 62239:2003
|
Process management for avionics. Preparation of an electronic components management plan |
UTEC 96 029 : 2011
|
ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
16/30344800 DC : 0
|
BS EN 60749-3 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
BS EN 60747-16-5:2013
|
Semiconductor devices Microwave integrated circuits. Oscillators |
I.S. EN 62435-5:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
I.S. EN 16812:2016
|
TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS |
CEI EN 60679-1 : 2009
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60747-16-1 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
CEI EN 61760-4 : 2016
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
ARINC 606A : 2004
|
GUIDANCE FOR ELECTROSTATIC SENSITIVE DEVICE UTILIZATION AND PROTECTION |
CEI EN 60749-3 : 2004
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
I.S. EN 61340-5-2:1999
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
IEC TS 62239:2008
|
Process management for avionics - Preparation of an electronic components management plan |
I.S. EN 14125:2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
VDI 2083 Blatt 17:2013-06
|
Cleanroom technology - Compatibility of materials with the required cleanliness |
VDI 2083 Blatt 18:2012-01
|
Cleanroom technology - Biocontamination control |
VDI 2083 Blatt 9.1:2006-12
|
Clean room technology - Compatibility with required cleanliness and surface cleanliness |
VDI 2083 Blatt 4.1:2006-10
|
Cleanroom technology - Planning, construction and start-up of cleanrooms |
VDI 2083 Blatt 5.1:2007-09
|
Cleanroom technology - Cleanroom operation |
VDI 2119:2013-06
|
Ambient air measurements - Sampling of atmospheric particles > 2,5 ?m on an acceptor surface using the Sigma-2 passive sampler - Characterisation by optical microscopy and calculation of number settling rate and mass concentration |
CEI CLC/TR 61340-5-2 : 2010
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
I.S. EN 62435-2:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
I.S. EN 60749-16:2003
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PARTICLE IMPACT NOISE DETECTION (PIND) |
BS EN 16812:2016
|
Textiles and textile products. Electrically conductive textiles. Determination of the linear electrical resistance of conductive tracks |
BS EN ISO 14644-9:2012
|
Cleanrooms and associated controlled environments Classification of surface cleanliness by particle concentration |
BS IEC 60747-16.2 : 2001
|
SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
IEC Q OD 3802 : 1ED 2015
|
IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - QUALITY SYSTEM REQUIREMENTS FOR MANUFACTURERS SEEKING IECQ LED COMPONENT PRODUCT CERTIFICATES OF CONFORMITY FOR COMPONENT PRODUCT(S) ASSOCIATED WITH LED LIGHTING |
15/30315510 DC : 0
|
BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
IEC 62435-4:2018
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage |
UNE-EN 16812:2016
|
Textiles and textile products - Electrically conductive textiles - Determination of the linear electrical resistance of conductive tracks |
BS EN 60679-1:2017
|
Piezoelectric, dielectric and electrostatic oscillators of assessed quality Generic specification |
08/30190157 DC : DRAFT SEP 2008
|
BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS |
BS IEC 60748-23-1:2002
|
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
09/30214337 DC : 0
|
BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
IEC TS 62239-2:2017
|
Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan |
IEC TR 61340-1:2012
|
Electrostatics - Part 1: Electrostatic phenomena - Principles and measurements |
IEC 61760-4:2015
|
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
EN 60747-16-4:2004/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
ISO/TS 20100:2008
|
Gaseous hydrogen Fuelling stations |
I.S. EN 60286-3:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV)) |
IEC TS 62239-1:2015
|
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
EN 61760-4:2015/A1:2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC 60679-1:2017
|
Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV
|
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters |
IEC 61340-2-1:2015
|
Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge |
IEC PAS 62686-1:2011
|
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
18/30359998 DC : 0
|
BS ISO 19880-1 - GASEOUS HYDROGEN - FUELLING STATIONS - PART 1: GENERAL REQUIREMENTS |
IEC 61340-5-3:2015
|
Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
EN 60747-16-5:2013
|
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators |
UNI EN 14125 : 2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
CEI EN 60749-16 : 2005
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND) |
PD IEC/TS 62239-2:2017
|
Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan |
DIN EN ISO 14644-9:2012-12
|
Cleanrooms and associated controlled environments - Part 9: Classification of surface cleanliness by particle concentration (ISO 14644-9:2012) |
CLC/TR 61340-5-2:2008
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
BS EN 62435-2:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
I.S. EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
PREN 14125 : DRAFT 2011
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
ESDA/JEDEC JS-002 : 2014
|
ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL |
BS EN 60749-3:2017
|
Semiconductor devices. Mechanical and climatic test methods External visual examination |
11/30231856 DC : 0
|
BS EN 14125 - THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
IEC TR 61340-5-2 REDLINE : 2ED 2018
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
17/30355242 DC : 0
|
BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
I.S. EN 61340-4-9:2016
|
ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS |
I.S. EN 61340-2-1:2015
|
ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE |
14/30288969 DC : 0
|
BS EN 61340-5-3 ED 2.0 - ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES |
BS EN 60286-3:2013
|
Packaging of components for automatic handling Packaging of surface mount components on continuous tapes |
14/30311058 DC : 0
|
BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
BS EN 61340-4-6:2015
|
Electrostatics Standard test methods for specific applications. Wrist straps |
PD CLC/TR 61340-5-2:2008
|
Electrostatics Protection of electronic devices from electrostatic phenomena. User guide |
13/30267320 DC : 0
|
BS EN 61340-4-6 ED 2.0 - ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 60749-3:2017
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
EN 60679-1:2017
|
Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
UNI EN ISO 14644-9 : 2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION |
I.S. EN 60747-16-5:2013
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
IEC TS 62686-1:2015
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
IEC 60749-3:2017
|
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
IEC 60747-16-2:2001+AMD1:2007 CSV
|
Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers |
IEC TR 62258-3:2010
|
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
17/30365636 DC : 0
|
BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
PD IEC/TS 62239-1:2015
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
DD IEC PAS 62686-1 : DRAFT JULY 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
ISO 14644-9:2012
|
Cleanrooms and associated controlled environments Part 9: Classification of surface cleanliness by particle concentration |
IEC 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
11/30211394 DC : DRAFT MAR 2011
|
BS ISO 20100 - GASEOUS HYDROGEN - FUELLING STATIONS |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61340-4-9:2016
|
Electrostatics - Part 4-9: Standard test methods for specific applications - Garments |
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV
|
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
UNE-EN 14125:2013
|
Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
IEC 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
IEC 61340-4-6:2015
|
Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
BS EN 14125:2013
|
Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
IEC 60286-3:2013
|
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
BS EN 62435-5:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
PD IEC/TS 62686-1:2015
|
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
EN 16812:2016
|
Textiles and textile products - Electrically conductive textiles - Determination of the linear electrical resistance of conductive tracks |
EN 14125:2013
|
Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
EN ISO 14644-9:2012
|
Cleanrooms and associated controlled environments - Part 9: Classification of surface cleanliness by particle concentration (ISO 14644-9:2012) |
BS EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017) |
ESD TR17.0-01 : 2015
|
BEST PRACTICES USED IN INDUSTRY |
PD IEC/TR 61340-5-2:2018
|
Electrostatics Protection of electronic devices from electrostatic phenomena. User guide |
CEI EN 60747-16-5 : 2014
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
13/30286163 DC : 0
|
BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
CEI EN 60747-16-3 : 2009
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
BS EN 60747-16-4 : 2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
ISO 18080-3:2015
|
Textiles Test methods for evaluating the electrostatic propensity of fabrics Part 3: Test method using manual friction |
I.S. EN 60747-16-3:2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN ISO 14644-9:2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012) |
EN 60747-16-3:2002/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
CEI CLC/TR 62258-3 : 2007
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
IEC 60748-23-1:2002
|
Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
ISO 4586-5:2015
|
High-pressure decorative laminates (HPL, HPDL) Sheets based on thermosetting resins (Usually called Laminates) Part 5: Classification and specifications for flooring grade laminates less than 2 mm thick intended for bonding to supporting substrates |
I.S. EN 60747-16-4:2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
IEC 60748-23-3:2002
|
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report |
EN 60747-16-1:2002/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
DIN EN 14125:2013-09
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
IEC 62258-1:2009
|
Semiconductor die products - Part 1: Procurement and use |
DD ISO/TS 20100:2008
|
Gaseous hydrogen. Fuelling stations |
CEI EN 62258-1 : 2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
EN 61340-5-3:2015
|
Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
EN 61340-4-6:2015
|
Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
EN 60286-3:2013/AC:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
EN 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
EN 61340-4-9:2016
|
Electrostatics - Part 4-9: Standard test methods for specific applications - Garments |
EN 60749-16:2003
|
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) |