BS EN 61340-5-2:2001
|
Electrostatics. Protection of electronic devices from electrostatic phenomena User guide |
BS EN 16602-70-08:2015
|
Space product assurance. Manual soldering of high-reliability electrical connections |
BS EN 61760-2:2007
|
Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
BS EN 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies General |
BS EN 60747-16-5:2013
|
Semiconductor devices Microwave integrated circuits. Oscillators |
BS EN 61340-5-3:2015
|
Electrostatics Protection of electronic devices from electrostatic phenomena. Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
BS EN 16602-20:2014
|
Space product assurance. Quality assurance |
CEI EN 61760-2 : 2008
|
SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
CEI EN 61760-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
BS EN 60747-16-3 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
BS EN 61191-1:2013
|
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
EN 60749-3:2017
|
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
CLC/TR 62258-3:2007
|
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
EN 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
PD CLC/TR 62258-3:2007
|
Semiconductor die products Recommendations for good practice in handling, packing and storage |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 16602-70-08:2015
|
SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS |
I.S. EN 16812:2016
|
TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS |
I.S. EN 60679-1:2017
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI EN 60679-1 : 2009
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PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60747-16-1 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
CEI EN 61760-4 : 2016
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
CEI EN 60749-3 : 2004
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
I.S. EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 60747-16-1:2002
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
I.S. EN 60286-3:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV)) |
I.S. EN 14125:2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
VDI 2083 Blatt 17:2013-06
|
Cleanroom technology - Compatibility of materials with the required cleanliness |
VDI 2083 Blatt 18:2012-01
|
Cleanroom technology - Biocontamination control |
OVE/ONORM EN 61760-1 : 2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
VDI 2083 Blatt 9.1:2006-12
|
Clean room technology - Compatibility with required cleanliness and surface cleanliness |
VDI 2083 Blatt 4.1:2006-10
|
Cleanroom technology - Planning, construction and start-up of cleanrooms |
VDI 2083 Blatt 5.1:2007-09
|
Cleanroom technology - Cleanroom operation |
VDI 2119:2013-06
|
Ambient air measurements - Sampling of atmospheric particles > 2,5 ?m on an acceptor surface using the Sigma-2 passive sampler - Characterisation by optical microscopy and calculation of number settling rate and mass concentration |
CEI CLC/TR 61340-5-2 : 2010
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
15/30315510 DC : 0
|
BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
UNE-EN 16812:2016
|
Textiles and textile products - Electrically conductive textiles - Determination of the linear electrical resistance of conductive tracks |
08/30190157 DC : DRAFT SEP 2008
|
BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS |
BS EN 61760-1:2006
|
Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
EN 60747-16-3:2002/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
EN 60747-16-4:2004/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
I.S. EN 60747-16-3:2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
EN 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
ISO 4586-3:2015
|
High-pressure decorative laminates (HPL, HPDL) Sheets based on thermosetting resins (Usually called Laminates) Part 3: Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates |
EN 61760-4:2015/A1:2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
EN 60747-16-5:2013
|
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators |
OVE/ONORM EN 61760-2 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
UNI EN 14125 : 2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
CLC/TR 61340-5-2:2008
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
11/30231856 DC : 0
|
BS EN 14125 - THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
PREN 14125 : DRAFT 2011
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
BS EN 60749-3:2017
|
Semiconductor devices. Mechanical and climatic test methods External visual examination |
CEI EN 60747-16-1 : 2009
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
BS EN 60286-3:2013
|
Packaging of components for automatic handling Packaging of surface mount components on continuous tapes |
BS EN 61340-4-6:2015
|
Electrostatics Standard test methods for specific applications. Wrist straps |
BS EN 60679-1:2017
|
Piezoelectric, dielectric and electrostatic oscillators of assessed quality Generic specification |
PD CLC/TR 61340-5-2:2008
|
Electrostatics Protection of electronic devices from electrostatic phenomena. User guide |
I.S. EN 60749-3:2017
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
EN 60679-1:2017
|
Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
I.S. EN 60747-16-5:2013
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
I.S. EN 16602-20:2014
|
SPACE PRODUCT ASSURANCE - QUALITY ASSURANCE |
EN 16602-20:2014
|
Space product assurance - Quality assurance |
UNE-EN 14125:2013
|
Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
BS EN 14125:2013
|
Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
BS EN 62435-5:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
EN 16812:2016
|
Textiles and textile products - Electrically conductive textiles - Determination of the linear electrical resistance of conductive tracks |
EN 14125:2013
|
Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
EN 16602-70-08:2015
|
Space product assurance - Manual soldering of high-reliability electrical connections |
BS EN 16812:2016
|
Textiles and textile products. Electrically conductive textiles. Determination of the linear electrical resistance of conductive tracks |
CEI EN 60747-16-5 : 2014
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
CEI EN 60747-16-3 : 2009
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
17/30355242 DC : 0
|
BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
BS EN 60747-16-4 : 2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
S.R. CLC/TR 61340-5-2:2008
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
I.S. CLC/TR 62258-3:2007
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
CEI CLC/TR 62258-3 : 2007
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 61760-2:2007
|
SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
I.S. EN 60747-16-4:2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
EN 60747-16-1:2002/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
DIN EN 14125:2013-09
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
EN 61340-5-3:2015
|
Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
EN 61340-4-6:2015
|
Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
EN 60286-3:2013/AC:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |