CEI EN 62047-10 : 2012
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS
Hardcopy , PDF
English
01-01-2012
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FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
finite element method
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-99. (08/2012)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 62047-10 : 2011 | Identical |
| IEC 62047-10:2011 | Identical |
| ASTM E 9 : 2009 | Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| EN 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
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