CEI EN 62047-14 : 2013

Current

Current The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS

Available format(s): Hardcopy, PDF

Language(s): English

Published date: 01-01-2013

Publisher: Comitato Elettrotecnico Italiano

Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Testing method
5 Test procedure and analysis
6 Test report
Annex A (informative) - Principles of the forming
        limit diagram
Annex B (informative) - Grid marking method
Annex C (informative) - Gripping method
Annex D (informative) - Strain measuring method
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Abstract - (Show below) - (Hide below)

Gives definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 [mu]m to 300 [mu]m.

General Product Information - (Show below) - (Hide below)

Committee	CT 309
Development Note	Classificazione CEI 309-36. (05/2013)
Document Type	Standard
ISBN
Pages
Published
Publisher	Comitato Elettrotecnico Italiano
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 62047-14:2012	Identical
EN 62047-14:2012	Identical

Standards Referencing This Book - (Show below) - (Hide below)

EN 62047-1:2016	Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016	Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Categories associated with this Standard - (Show below) - (Hide below)

Sub-Categories associated with this Standard - (Show below) - (Hide below)

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