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  • EN 62047-1:2016

    Current The latest, up-to-date edition.

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

    Available format(s): 

    Language(s): 

    Published date:  08-04-2016

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Terms and definitions
    Annex A (informative) - Standpoint and criteria in editing
            this glossary
    Annex B (informative) - Clause cross-references of
            IEC 62047-1:2005 and IEC 62047-1:2015
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices.This edition includes the following significant technical changes with respect to the previous edition:a) removal of ten terms;b) revision of twelve terms;c) addition of sixteen new terms.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 47F
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
    I.S. EN 62047-4:2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    CEI EN 60876-1 : 2015 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
    I.S. EN 62047-14:2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV))
    BS EN 60876-1:2014 Fibre optic interconnecting devices and passive components. Fibre optic spatial switches Generic specification
    BS EN 62047-14:2012 Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials
    I.S. EN 62047-25:2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
    CEI EN 62047-14 : 2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS
    BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
    EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
    EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
    CEI EN 62047-4 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    CEI EN 62047-25 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
    I.S. EN 60876-1:2014 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
    EN 60876-1:2014 Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60050-815:2015 International Electrotechnical Vocabulary (IEV) - Part 815: Superconductivity
    ISO 2041:2009 Mechanical vibration, shock and condition monitoring Vocabulary
    IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
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