10/30211446 DC : 0
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BS EN 62047-11 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR LINEAR THERMAL EXPANSION COEFFICIENTS OF MEMS MATERIALS |
BS EN 62047-25:2016
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Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area |
I.S. EN 62047-4:2010
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
08/30172398 DC : DRAFT FEB 2008
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BS EN 62047-8 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
CEI EN 60876-1 : 2015
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FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
BS EN 62047-4:2010
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Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS |
BS IEC 60747-14.1 : 2010
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SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
10/30211442 DC : 0
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BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS |
I.S. EN 62047-14:2012
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV)) |
BS EN 60876-1:2014
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Fibre optic interconnecting devices and passive components. Fibre optic spatial switches Generic specification |
BS EN 62047-14:2012
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Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials |
05/30104054 DC : DRAFT APR 2005
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IEC 62047-3 - SEMICONDUCTOR DEVICES - PART 3: MICRO ELECTROMECHANICAL DEVICES - THIN FILM STANDARD TEST PIECE |
13/30288636 DC : 0
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BS EN 60876-1 - FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
I.S. EN 62047-25:2016
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
CEI EN 62047-14 : 2013
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS |
BS EN 62047-1:2016
|
Semiconductor devices. Micro-electromechanical devices Terms and definitions |
08/30181401 DC : DRAFT APR 2008
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BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
17/30355768 DC : 0
|
BS IEC 62047-32 ED.1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 32: TEST METHOD FOR THE NONLIEAR VIBRATION OF THE MEMS RESONATORS |
NF EN 62047-14 : 2012
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS |
I.S. EN 62047-1:2016
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 1: TERMS AND DEFINITIONS |
IEC 62047-25:2016
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Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area |
09/30199223 DC : DRAFT JAN 2009
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BS EN 60876-1 - FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
IEC 60876-1:2014
|
Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification |
IEC 62047-14:2012
|
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
IEC 62047-4:2008
|
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
EN 62047-14:2012
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Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
EN 62047-4:2010
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Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
CEI EN 62047-4 : 2011
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
14/30296140 DC : 0
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BS EN 62047-25 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON-BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
CEI EN 62047-25 : 1ED 2017
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
07/30148822 DC : 0
|
BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS |
IEC 60747-14-1:2010
|
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
I.S. EN 60876-1:2014
|
FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
EN 60876-1:2014
|
Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification |