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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2012
Publisher: Comitato Elettrotecnico Italiano
FOREWORD1 Scope 2 Normative references 3 Measurement methodsAnnex A (informative) - Example of bonding forceAnnex B (informative) - An example of the fabrication process for three-point bending specimens BibliographyAnnex ZA (normative) - Normative references to international publications with their corresponding European publications
Defines bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly.
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