CLC/TR 62258-4:2013
Current
The latest, up-to-date edition.
Semiconductor die products - Part 4: Questionnaire for die users and suppliers
11-01-2013
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Data exchange
Annex A (normative) - Customer questionnaire on
die devices
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:- wafers;- singulated bare die;- die and wafers with attached connection structures;- minimally or partially encapsulated die and wafers.This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein.This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.
Committee |
CLC/TC 47X
|
DocumentType |
Technical Report
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
NEN NPR CLC IEC/TR 62258-4 : 2013 | Identical |
PD CLC/TR 62258-4:2013 | Identical |
S.R. CLC/TR 62258-4:2013 | Identical |
CEI CLC/TR 62258-4 : 2013 | Identical |
IEC TR 62258-4:2012 | Identical |
BS EN IEC 62275:2019 | Identical |
S.R. TR 62258-4:2007 | Identical |
CEI CLC/TR 62258-7 : 2009 | SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
CLC/TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
S.R. TR 62258-7:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
CEI CLC/TR 62258-8 : 2009 | SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
CLC/TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
S.R. CLC/TR 62258-8:2008 | SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
IEC TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
IEC TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
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