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I.S. EN 62258-1:2010

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers with or without
   connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Describes the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
50
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
BS EN 62258-1:2010 Identical
SN EN 62258-1 : 2005 Identical
EN 62258-1:2010 Identical
NF EN 62258-1 : 2011 Identical
IEC 62258-1:2009 Identical
NBN EN 62258-1 : 2010 Identical
DIN EN 62258-1 : 2011 Identical

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IEC TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
ISO 8879:1986 Information processing Text and office systems Standard Generalized Markup Language (SGML)
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