DIN EN 60191-6-21:2011-03
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2011
€95.42
Excluding VAT
| DevelopmentNote |
Supersedes DIN IEC 60191-6-21. (03/2011)
|
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60191-6-21:2010 | Identical |
| IEC 60191-6-21:2010 | Identical |
Summarise
Access your standards online with a subscription
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.
Important note : Users cannot be edited or removed once added to your Multi user PDF.