IEC 60191-6-21:2010
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Hardcopy , PDF
English, English - French
30-08-2010
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-6-21 : 2011 | Identical |
| NBN EN 60191-6-21 : 2010 | Identical |
| NEN EN IEC 60191-6-21 : 2010 | Identical |
| PN EN 60191-6-21 : 2011 | Identical |
| BS EN 60191-6-21:2010 | Identical |
| CEI EN 60191-6-21 : 2011 | Identical |
| EN 60191-6-21:2010 | Identical |
| DIN EN 60191-6-21:2011-03 | Identical |
| I.S. EN 60191-6-21:2010 | Equivalent |
| UNE-EN 60191-6-21:2010 | Identical |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.