Skip to content
Please enter a keyword to search

  • IEC 60191-6-21:2010

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  30-08-2010

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Measuring methods

    Abstract - (Show below) - (Hide below)

    IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    I.S. EN IEC 60191-1:2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective