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DIN EN 60191-6-4:2004-01

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2004

€85.79
Excluding VAT

1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
   4.1 Ball grid array package (BGA) Type 1 - Ball datum
   4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
   5.1 Datum S pertaining to ball coplanarity
   5.2 Datum A, B
   5.3 Definition of specified dimensions and measuring method
   5.4 Profile of a package edge surface v
   5.5 Mounting height A
   5.6 First stand-off A1
   5.7 Second stand-off A4
   5.8 Ball diameter b
   5.9 Ball center position X
   5.10 Ball coplanarity y
   5.11 Package top flatness y1
Annex ZA: Normative references to international publications
         with their corresponding European publications

Includes requirements for the measuring methods of ball grid array (BGA) dimensions.

DocumentType
Standard
Pages
20
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current

Standards Relationship
EN 60191-6-4:2003 Identical
SN EN 60191-6-4 : 2003 Identical
IEC 60191-6-4:2003 Identical
I.S. EN 60191-6-4:2003 Identical
BS EN 60191-6-4:2003 Identical
NF EN 60191-6-4 : 2003 Identical
NBN EN 60191-6-4 : 2004 Identical

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