DIN EN 60749-20-1:2009-10
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2009
Important note : Users cannot be edited or removed once added to your Multi user PDF.Dieser Teil der DIN EN 60749 gilt für alle oberflächenmontierbaren Bauelemente (SMD) mit nicht hermetisch dichten Gehäusen, welche in einem Reflow-Lötverfahren beansprucht werden und die der Umgebungsatmosphäre ausgesetzt werden.
| DevelopmentNote |
Supersedes DIN IEC 60749-20-1. (10/2009)
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60749-20-1:2009 | Identical |
| EN 60749-20-1 : 2009 | Identical |
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