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DIN EN 60749-20:2010-04

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009

Available format(s)

Hardcopy , PDF

Superseded date

01-07-2023

Language(s)

German

Published date

01-04-2010

€104.95
Excluding VAT

INTRODUCTION
1 Scope and object
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given in the relevant specification
Annex A (normative) Methods of inspection by acoustic
        tomography
Annex B (informative) Details and descriptions of test method
        on resistance of plastic-encapsulated SMDs to the
        combined effect of moisture and soldering heat
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).

DevelopmentNote
Supersedes DIN EN 60749. (06/2005)
DocumentType
Standard
Pages
28
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
EN 60749-20:2009 Identical
NF EN 60749-20 : 2010 Identical
UNE-EN 60749-20:2004 Identical
BS EN 60749-20:2009 Identical
I.S. EN 60749-20:2009 Identical
IEC 60749-20:2008 Identical
NBN EN 60749-20 : 2010 Identical

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