• DIN EN 61189-2:2007-01

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2007

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Accuracy, precision and resolution
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
    9 M: Mechanical test methods
    10 E: Electrical test methods
    11 N: Environmental test methods
    12 X: Miscellaneous test methods
    Tables
    1 Student's "t" distribution
    2 Test pattern dimensions
    3 Arc resistance
    4 Cleaning procedures
    Figures
    1 Position of specimens
    2 Fluidized sand bath
    3 Electrode dimensions for volume resistivity and surface
        resistivity tests
    4 Electrode connections for measuring volume resistance
    5 Electrode connections for measuring surface resistance
    6 Arc-resistance test circuit
    7 Tungsten steel rod electrode assembly
    8 Specimen for peel strength measurement
    9 Punched test pattern for squeeze-out test
    10 Test patterns for clearance filling test
    11 Standard lay-up of materials in the press to prepare
        the test specimens for referee tests
    12 Profiles of press conditions to prepare the test
        specimens for referee tests
    Annexes
    A Worked examples
    B Conversion table
    ZA (Normative) Normative references to international
        publications with their corresponding European
        publications

    Abstract - (Show below) - (Hide below)

    Gives a catalogue of test methods representing methodologies and procedures for application to test materials for manufacture of interconnection structures (printed boards) and assemblies.

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    Development Note Supersedes DIN IEC 52/569/CD. (03/2001) Supersedes DIN IEC 61189-2. (01/2007)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    DIN EN 61249-3-3:1999-11 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-3: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS); ADHESIVE COATED FLEXIBLE POLYESTER FILM
    DIN EN 61249-3-4:1999-11 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-4: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS); ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
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