FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
3.1 Accuracy
3.2 Precision
3.3 Resolution
3.4 Report
3.5 Student's 't' distribution
3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
5.1 Test 2P01: Dry heat (under consideration)
5.2 Test 2P02: Solder float stress (under consideration)
6 V: Visual test methods
7 D: Dimensional test methods
7.1 Test 2D01: Thickness of base materials and rigid boards
8 C: Chemical test methods
8.1 Test 2C01: Resistance to sodium hydroxide of base
materials
8.2 Test 2C02: Gel time of epoxy based prepreg materials
8.3 Test 2C03: Resin content of prepreg materials by
treated weight
8.4 Test 2C04: Volatile content of prepreg materials
8.5 Test 2C05: Blistering during heat shock
8.6 Test 2C06: Flammability, vertical burning test for
rigid materials
8.7 Test 2C07: Flammability; horizontal burning test for
rigid materials
8.8 Test 2C08: Flammability, flex material
8.9 Test 2C09: Melting viscosity of prepreg materials
8.10 Test 2C10: Resin content of prepreg materials by sublimation
8.11 Test 2C11: UV blocking characteristics of laminates
8.12 Test 2C12: Total halogen content in base materials
9 M: Mechanical test methods
9.1 Test 2M01: Test method for bow and twist
9.2 Test 2M02: Bow/twist after etching and heating
9.3 Test 2M03: Cure factor of base materials by differential
scanning calorimetry (DSC) or thermomechanical analysis (TMA)
9.4 Test 2M04: Twist after heating (under consideration)
9.5 Test 2M05: Pull-off strength
9.6 Test 2M06: Peel strength after exposure to solvent vapour
9.7 Test 2M07: Peel strength after immersion in solvent
9.8 Test 2M08: Flexural strength (under consideration)
9.9 Test 2M09: Resin flow of prepreg material
9.10 Test 2M10: Glass transition temperature of base materials
by differential scanning calorimetry (DSC)
9.11 Test 2M11: Glass transition temperature of base materials
by thermomechanical analysis (TMA)
9.12 Test 2M12: Surface waviness
9.13 Test 2M13: Peel strength as received
9.14 Test 2M14: Peel strength after heat shock
9.15 Test 2M15: Peel strength after dry heat
9.16 Test 2M16: Peel strength after simulated plating
9.17 Test 2M17: Peel strength at high temperature
9.18 Test 2M18: Surface quality (under consideration)
9.19 Test 2M19: Punching (under consideration)
9.20 Test 2M20: Flexural strength
9.21 Test 2M21: Rolling fatigue of flexible base materials
9.22 Test 2M22: Weight of foil after lamination
9.23 Test method 2M23: Rectangularity of cut panels
9.24 Test 2M24: Coefficient of thermal expansion (under
consideration)
9.25 Test 2M25: Time to delamination by thermomechanical
analysis (TMA)
9.26 Test 2M26: Scaled flow test for prepreg materials
9.27 Test 2M27: The resin flow properties of coverlay films,
bonding films and adhesive cast films used in the
fabrication of flexible printed boards
10 Electrical test methods
10.1 Test 2E01: Surface tracking, moisture condition (under
consideration)
10.2 Test 10.2 2E02: Dielectric breakdown of base materials
parallel to laminations
10.3 Test 2E03: Surface resistance after damp heat, steady state
10.4 Test 2E04: Volume resistivity and surface resistivity
10.5 Test 2E05: Permittivity and dielectric dissipation
(under consideration)
10.6 Test 2E06: Volume and surface resistivity, 3 electrodes
(under consideration)
10.7 Test 2E07: Surface and volume resistivity, elevated
temperature (under consideration)
10.8 Test 2E08: Surface corrosion
10.9 Test 2E09: Comparative tracking index (CTI)
10.10 Test 2E10: Permittivity and dissipation factor (under
consideration)
10.11 Test 2E11: Electric strength (under consideration)
10.12 Test 2E12: Resistance of foil (under consideration)
10.13 Test 2E13: Corrosion at edge (under consideration)
10.14 Test 2E14: Arc resistance
10.15 Test 2E15: Dielectric break-down (under consideration)
10.16 Test 2E16: Contact resistance of printed circuit keypad
cont (under consideration)
10.17 Test 2E17: Insulation resistance of printed board materials
10.18 Test 2E18: Fungus resistance of printed board materials
11 N: Environmental test methods
11.1 Test 2N01: Pressure cooker test (under consideration)
11.2 Test 2N02: Water absorption
12 X: Miscellaneous test methods
12.1 Test 2X02: Dimensional stability of thin laminates
Annex A (informative) Worked examples
Annex B (informative) Conversion table
Annex C (informative) Laboratory pro forma (form)
Annex D (informative) Laboratory pro forma
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications