• DIN EN 61192-3:2003-10

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Workmanship requirements for soldered electric assemblies - Part 3: Through-hole mount assemblies (IEC 61192-3:2002); German version EN 61192-3:2003

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  26-06-2022

    Language(s):  German

    Published date:  01-10-2003

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Inspection techniques
       4.4 Interpretation of requirements
    5 Component preparation processes
       5.1 Lead forming
       5.2 Lead protrusion and clinching
       5.3 Lead cutting/cropping
       5.4 Pre-tinning
    6 Masking attributes
       6.1 Misalignment
       6.2 Improper adhesion
       6.3 Thermal capability
    7 Insertion of through-hole components
       7.1 General requirements
       7.2 Orientation and mounting criteria
       7.3 Missing components
       7.4 Wrong components
       7.5 Damaged components
    8 Soldering process attributes
       8.1 General requirements
       8.2 Misalignment
       8.3 Damaged components
       8.4 Solder joint characteristics
    9 Cleaning attributes
       9.1 Flux residues
       9.2 Other residues
    10 Rework/replacement attributes
    Annex ZA (normative) Normative references to international
             publications with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

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    Development Note Supersedes DIN IEC 91-159-CD. (10/2003)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Withdrawn
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