• BS EN 61192-3 : 2003

    Current The latest, up-to-date edition.

    WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Inspection techniques
       4.4 Interpretation of requirements
    5 Component preparation processes
       5.1 Lead forming
       5.2 Lead protrusion and clinching
       5.3 Lead cutting/cropping
       5.4 Pre-tinning
    6 Masking attributes
       6.1 Misalignment
       6.2 Improper adhesion
       6.3 Thermal capability
    7 Insertion of through-hole components
       7.1 General requirements
       7.2 Orientation and mounting criteria
       7.3 Missing components
       7.4 Wrong components
       7.5 Damaged components
    8 Soldering process attributes
       8.1 General requirements
       8.2 Misalignment
       8.3 Damaged components
       8.4 Solder joint characteristics
    9 Cleaning attributes
       9.1 Flux residues
       9.2 Other residues
    10 Rework/replacement attributes
    Annex ZA (normative) Normative references to international
             publications with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

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    Committee EPL/501
    Development Note Supersedes 98/232815 DC (04/2003)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61192-2 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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