• There are no items in your cart

DIN EN 61760-1:2006-10

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006

Available format(s)

Hardcopy , PDF

Superseded date

26-11-2022

Language(s)

German

Published date

01-10-2006

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General requirements
    4.1 Contents of specifications
    4.2 Declaration of soldering process suitability
    4.3 Packaging and packaging marking
    4.4 Component marking
    4.5 Storage
    4.6 Component outline
    4.7 Mechanical stress
    4.8 Ordering information
5 Identification of assembly process conditions
    5.1 General
    5.2 Placement
    5.3 Securing the component on the substrate prior to
          soldering
    5.4 Soldering methods
    5.5 Cleaning (if applicable)
    5.6 Removal and/or replacement of SMDs
    5.7 Special handling conditions
6 Reference conditions
    6.1 Soldering processes, temperature/time profiles
    6.2 Classification
    6.3 Reference set of assembly cleaning conditions
7 Tests
    7.1 General
    7.2 Soldering
    7.3 Resistance to mechanical forces
    7.4 Resistance to cleaning solvent
Tables
1 SMD classification related to tests and soldering
    processes
2 Basic cleaning procedures
3 Immersion conditions related to processes to be
    simulated
4 Immersion conditions for solderability (wetting and
    dewetting) and dissolution of metallization
Figures
1 Manufacturing steps
2 Vapour phase soldering, batch system with preheating -
    Temperature/time profile (terminal temperature)
3 Vapour phase soldering, in-line system with preheating -
    Temperature/time profile (terminal temperature)
4 Infrared soldering, forced gas convection soldering -
    temperature/time profile (terminal temperature)
5 Double wave soldering - Temperature/time profile (terminal
    temperature)
A.1 Examples of immersion for solderability testing
A.2 Components with gull-wing leads
A.3 Components with J-leads
A.4 Cubic or cylindrical components
A.5 Components with rectangular leads
A.6 Components with butt leads
Annex A (normative) Test methods for soldering
Annex ZA Normative references to international publications
with their corresponding European publications

Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

DevelopmentNote
Supersedes DIN IEC 61760-1. (10/2006)
DocumentType
Standard
Pages
31
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
I.S. EN 61760-1:2006 Identical
EN 61760-1:2006 Identical
IEC 61760-1:2006 Identical
BS EN 61760-1:2006 Identical
SN EN 61760-1 : 1998 Identical
NBN EN 61760-1 : 2007 Identical
NF EN 61760-1 : 2014 Identical

View more information
€104.95
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.