DIN EN 62047-2:2007-02
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS
Hardcopy , PDF
German
01-01-2007
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1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
4.1 Method of gripping
4.2 Method of loading
4.3 Speed of testing
4.4 Force measurement
4.5 Elongation measurement
4.6 Stress-strain curve
4.7 Environment control
5 Test piece
5.1 General
5.2 Plane shape of test piece
5.3 Test piece thickness
5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
| DevelopmentNote |
Supersedes DIN IEC 62047-2. (02/2007)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 62047-2:2006 | Identical |
| EN 62047-2:2006 | Identical |
| NBN EN 62047-2 : 2007 | Identical |
| I.S. EN 62047-2:2006 | Identical |
| NF EN 62047-2 : 2006 | Identical |
| BS EN 62047-2:2006 | Identical |
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