DIN EN 62258-6:2007-02
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
Hardcopy , PDF
German
01-01-2007
Important note : Users cannot be edited or removed once added to your Multi user PDF.
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
5.1 Requirements for bare die with or without added
connection structures
5.2 Requirements for minimally-packaged die
5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Provides the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
| DevelopmentNote |
Supersedes DIN IEC 62258-6. (02/2007)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 62258-6:2006 | Identical |
| NBN EN 62258-6 : 2007 | Identical |
| EN 62258-6 : 2006 | Identical |
| I.S. EN 62258-6:2006 | Identical |
| NF EN 62258-6 : 2006 | Identical |
| BS EN 62258-6:2006 | Identical |
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