DOD HDBK 263 : LATEST
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)METRIC
Superseded date
22-02-1991
Superseded by
Published date
12-01-2013
Publisher
Sorry this product is not available in your region.
Provides information about developing, implementing and monitoring parts of an ESD control program.
| DocumentType |
Standard
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
| MIL-E-16400 Revision H:1987 | ELECTRONIC, INTERIOR COMMUNICATIONS AND NAVIGATION EQUIPMENT, NAVAL SHIP AND SHORE, GENERAL SPECIFICATION FOR |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| MIL-A-83577 Revision B:1988 | ASSEMBLIES, MOVING MECHANICAL, FOR SPACE AND LAUNCH VEHICLES, GENERAL SPECIFICATION FOR |
| MIL-E-17555 Revision H:1984 | ELECTRONIC AND ELECTRICAL EQUIPMENT, ACCESSORIES, AND PROVISIONED ITEMS (REPAIR PARTS); PACKAGING OF |
| MIL-STD-989 Base Document:1991 | CERTIFICATION REQUIREMENTS FOR JAN SEMICONDUCTOR DEVICES |
| MIL W 87893 : A | WORKSTATION, ELECTROSTATIC DISCHARGE (ESD) CONTROL |
| MIL-HDBK-244 Revision A:1990 | GUIDE TO AIRCRAFT - STORES COMPATIBILITY |
| DOD-STD-2000-2 Revision A:1986 | PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-HDBK-87244 Base Document:1995 | AVIONICS/ELECTRONICS INTEGRITY |
| MIL E 917 : E | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS (NAVAL SHIPBOARD USE) |
| MIL C 85629 : A (1) | CONTROL MONITOR SET GUIDED WEAPON, AN/AWW-13 |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| SAE AS5363A | Electromechanical Power Controller/Relay, General Specification For |
| MIL-STD-2077 Revision B:1991 | TEST PROGRAM SETS GENERAL REQUIREMENTS FOR |
| MIL-T-24632 Base Document:1984 | TELEPHONE SYSTEM, SOUND POWERED, SHIPS SERVICE AN/WTC-2()(V) |
| MIL R 83536 : SUPP 1 | RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY |
| MIL-STD-1686 Revision C:1995 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
| MIL-E-24762 Base Document:1991 | ENCLOSURES FOR ELECTRONIC EQUIPMENT, SURVIVABLE, NAVAL SHIPBOARD USE |
| MIL-C-64030 Base Document:1986 | CONTROL INDICATOR FOR DISPENSER AND MINES GROUND M131 |
| MIL-B-29511 Base Document:1988 | BUOY INTERFACE UNIT (BIU), J-3958/BRT-6 |
| MIL-P-116 Revision J:1988 | PRESERVATION, METHODS OF |
| MIL-P-11268 Revision L:1983 | PART, MATERIALS, AND PROCESSES USED IN ELECTRONIC EQUIPMENT |
| DOD STD 1686 : 0 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)(METRIC) |
| MIL-P-24764 Base Document:1991 | POWER SUPPLIES, SHIPBOARD, ELECTRONIC, GENERAL SPECIFICATION FOR |
| MIL P 82646 : A | PLASTIC FILM, CONDUCTIVE, HEAT-SEALABLE, FLEXIBLE |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| MIL-STD-701 Revision P:1992 | LISTS OF STANDARD SEMICONDUCTOR DEVICES |
| MIL B 81705 : C | BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE |
| DOD STD 1686 : 0 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)(METRIC) |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| MIL P 81997 : B | POUCHES, CUSHIONED, FLEXIBLE, ELECTROSTATIC FREE, RECLOSABLE, TRANSPARENT |
| FED-STD-101 Revision C:1980 | TEST PROCEDURES FOR PACKAGING MATERIALS |
| ASTM D 257 : 2014 : REDLINE | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
| PPP-C-1842 Revision B:1992 | CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS) |
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