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  • MIL-STD-989 Base Document:1991

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    CERTIFICATION REQUIREMENTS FOR JAN SEMICONDUCTOR DEVICES

    Available format(s):  PDF

    Withdrawn date:  28-07-1995

    Language(s):  English

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Abstract - (Show below) - (Hide below)

    Establishes the minimum requirements for the certification of manufacturing facilities/lines used in fabricating, assembling and testing high reliability JAN semiconductors in accordance with MIL-S-19500.

    General Product Information - (Show below) - (Hide below)

    Committee FSC 5961
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    DOD 4120.3M : 1993 DEFENSE STANDARDIZATION PROGRAM (DSP) POLICIES AND PROCEDURES OFFICE OF THE ASSISTANT SECRETARY OF DEFENSE PRODUCTION AND LOGISTICS

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM F 671 : 1999 Standard Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials (Withdrawn 2003)
    ASTM F 613 : 1993 Test Method for Measuring Diameter of Semiconductor Wafers (Withdrawn 2001)
    ASTM F 416 : 1994 Test Method for Detection of Oxidation Induced Defects in Polished Silicon Wafers (Withdrawn 1998)
    MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
    MIL-HDBK-279 Base Document:1985 TOTAL DOSE HARDNESS ASSURANCE GUIDELINE FOR SEMICONDUCTOR DEVICE & MICROCIRCUIT
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    DOD HDBK 263 : LATEST ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)METRIC
    MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    ASTM F 657 : 1992 : R1999 Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 2003)
    ASTM F 43 : 1999 Standard Test Methods for Resistivity of Semiconductor Materials (Withdrawn 2003)
    ASTM F 120 : 1988 Practices for Determination of the Concentration of Impurities in Single Crystal Semiconductor Materials by Infrared Absorption Spectroscopy (Withdrawn 1993)
    MIL-HDBK-280 Base Document:1985 NEUTRON HARDNESS ASSURANCE GUIDELINES FOR SEMICONDUCTOR DEVICES AND MICROCIRCUITS
    ASTM F 47 : 1994 Test Method for Crystalographic Perfection of Silicon by Preferential Etch Techniques (Withdrawn 1998)
    ASTM F 121 : 1983 : EDT 1 Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption (Withdrawn 1989)
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