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EN 60191-4:2014/A1:2018

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES (IEC 60191-4:2013/A1:2018)

Amendment of

EN 60191-4:2014

Published date

18-05-2018

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FOREWORD
1 Scope
2 Coding system of package outlines for semiconductor
  devices
3 Classification into forms of package outlines for
  semiconductor devices
4 Coding systems for semiconductor-device packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive coding system
        application
Annex B (informative) - Derivation and application of the
        descriptive coding system - Common package names
Annex C (informative) - Terminology of
        semiconductor package outlines

Defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

Committee
SR 47D
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

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