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  • BS EN 60191-6-12:2011

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  31-08-2011

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Terminal position numbering
    5 Nominal package dimension
    6 Outline drawings and principle dimensions
    7 Dimensions
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Gives standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

    Scope - (Show below) - (Hide below)

    IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
    - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: \'Rectangular type\' has been deleted from the title;
    - ball pitch of 0,3 mm has been added;
    - datum is changed from the body datum to the ball datum;
    - combination lists of D, E, MD, and ME have been revised.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 02/204115 DC (10/2002) Supersedes 10/30215537 DC. (08/2011)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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