EN 60249-2-12 : 1994 AMD 4 2000
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
01-09-2005
12-01-2013
FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material after
complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references of
the relevant European publications
Provides requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. These laminated sheets have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). Materials may be used for single sided or double sided printed boards.
| DevelopmentNote |
Supersedes HD 313.2.12 (06/2001)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60249-2-12:1987 | Identical |
| DIN EN 60249-2-12:2001-09 | Identical |
| NF EN 60249 2-12 : 96 AMD 4 2001 | Identical |
| I.S. EN 60249-2-12:1994 | Identical |
| SN EN 60249-2-12 : 1994 AMD 4 2000 | Identical |
| NBN EN 60249 2-12 : 96 AMD 1 2001 | Identical |
| PN EN 60249-2-12 : 2000 | Identical |
| NEN EN IEC 60249-2-12 : 1994 AMD 4 2001 | Identical |
| BS EN 60249-2-12:1994 | Identical |
| UNE-EN 60249-2-12/A4:2001 | Identical |
| UNE-EN 60249-2-12:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
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