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  • EN 61249-2-7:2002/corrigendum:2005

    Current The latest, up-to-date edition.

    MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD

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    Language(s): 

    Published date:  27-09-2005

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Materials and construction
       3.1 Insulating base
       3.2 Metal foil
       3.3 Reinforcement
    4 Internal marking
    5 Electrical properties
    6 Non-electrical properties of the copper-clad laminate
       6.1 Appearance of the copper-clad sheet
       6.2 Appearance of the unclad face
       6.3 Laminate thickness
       6.4 Bow and twist
       6.5 Properties related to the copper foil bond
       6.6 Punching and machining
       6.7 Dimensional stability
       6.8 Sheet sizes
       6.9 Cut panels
    7 Non-electrical properties of the base material after
       removal of the copper foil
       7.1 Appearance of the dielectric base material
       7.2 Flexural strength
       7.3 Flammability
       7.4 Water absorption
       7.5 Measling
       7.6 Glass transition temperature and cure factor
    8 Quality assurance
       8.1 Quality system
       8.2 Responsibility for inspection
       8.3 Qualification inspection
       8.4 Quality conformance inspection
       8.5 Certificate of conformance
       8.6 Safety data sheet
    9 Packaging and marking
    10 Ordering information
    Annex A (informative) Engineering information
    Annex B (informative) Common laminate constructions
    Annex C (informative) Guideline for the qualification
            and conformance inspection
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Provides recommendations for properties of epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper clad.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Development Note Supersedes EN 60249-2-5 & EN 60249-2-12. (08/2006)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62137-3:2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
    CEI EN 62137-1-4 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
    I.S. EN 62137-1-5:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    BS EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    BS EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61051-1:2008 Varistors for use in electronic equipment Generic specification
    BS EN 60127-2:2014 MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS
    BS EN 60539-1:2016 Directly heated negative temperature coefficient thermistors Generic specification
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    OVE/ONORM EN 61051-1 : 2009 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 60738-1:2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    CEI EN 50155 : 2008 RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
    I.S. EN 61051-1:2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    CEI EN 61249-4-11 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 62137-1-4:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    I.S. EN 60352-8:2011 SOLDERLESS CONNECTIONS - PART 8: COMPRESSION MOUNT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
    CEI EN 61249-4-12 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS EN 60068-2-21:2006 Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
    16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
    EN 62326-1:2002 Printed boards - Part 1: Generic specification
    EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    EN 61051-1:2008 Varistors for use in electronic equipment - Part 1: Generic specification
    EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    EN 60738-1:2006/A1:2009 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
    EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    I.S. EN 62137-1-1:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    BS EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    CEI EN 62137-1-5 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    BS EN 62326-1:2002 Printed boards Generic specification
    BS EN 62137-1-5:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
    BS EN 62024-1:2008 High frequency inductive components. Electrical characteristics and measuring methods Nanohenry range chip inductor
    BS EN 60738-1 : 2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    BS EN 60127-3:2015 MINIATURE FUSES - PART 3: SUB-MINIATURE FUSE-LINKS
    CEI EN 60393-1 : 2010 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    I.S. EN 62137-1-2:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    I.S. EN 61249-4-1:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    BS EN 60352-8:2011 Solderless connections Compression mount connections. General requirements, test methods and practical guidance
    BS EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 62137-1-2:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
    BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
    BS EN 60127-7:2016 Miniature fuses Miniature fuse-links for special applications
    BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
    CEI EN 60352-8 : 2012 SOLDERLESS CONNECTIONS - PART 8: COMPRESSION MOUNT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
    EN IEC 62024-1:2018 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
    I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 60068-2-21:2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
    I.S. EN 60393-1:2009 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
    EN 60127-3:2015 Miniature fuses - Part 3: Sub-miniature fuse-links
    EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
    CEI EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    BS EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    CEI EN 61051-1 : 2010 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 62137-1-4:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
    I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    CEI EN 62137-1-1 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    I.S. EN 60127-3:2015 MINIATURE FUSES - PART 3: SUB-MINIATURE FUSE-LINKS
    I.S. EN 62137-1-3:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    EN 62137-1-1 : 2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    I.S. EN 60127-7:2016 MINIATURE FUSES - PART 7: MINIATURE FUSE-LINKS FOR SPECIAL APPLICATIONS
    BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
    I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS EN 61249-4-14:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 60393-1:2009 Potentiometers for use in electronic equipment Generic specification
    I.S. EN 61249-4-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 62137-1-2 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    BS EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
    CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    I.S. EN IEC 62024-1:2018 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
    I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
    I.S. EN 61249-4-12:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    I.S. EN 62024-1:2008 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
    I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION
    EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    EN 60127-7:2016 Miniature fuses - Part 7: Miniature fuse-links for special applications
    EN 60127-2:2014 Miniature fuses - Part 2: Cartridge fuse-links
    EN 60352-8:2011 Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
    EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
    EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 60393-1:2009 Potentiometers for use in electronic equipment - Part 1: Generic specification
    EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
    EN 61249-4-14 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    ISO 11014-1:1994 Safety data sheet for chemical products Part 1: Content and order of sections
    IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    ISO 14001:2015 Environmental management systems — Requirements with guidance for use
    EN ISO 14001:2015 Environmental management systems - Requirements with guidance for use (ISO 14001:2015)
    ISO 9000:2015 Quality management systems Fundamentals and vocabulary
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN ISO 9000:2015 Quality management systems - Fundamentals and vocabulary (ISO 9000:2015)
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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