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CENELEC
EN 60249-2-13 : 1994 AMD 1 1994

EN 60249-2-13 : 1994 AMD 1 1994

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE

Withdrawn date

01-02-2006

Published date

12-01-2013

Publisher

European Committee for Standards - Electrical

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Foreword
Preface
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material
  after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
9 Additional requirements
Annex ZA (normative) Other international publications
         quoted in this standard with the references of
         the relevant European publications

Provides requirements for properties of flexible copper clad polyimide film, general purpose grade with optional requirements only by agreement between purchaser and supplier. Copper clad film complying with all the requirements not marked 'optional' should be deemed to comply with this specification. Includes internal marking, electrical properties, non-electrical properties of the copper clad film, non-electrical properties of the base material after complete removal of the copper foil, packaging and marking, acceptance testing and additional requirements.

Committee
SR 91
DevelopmentNote
Supersedes HD 313.2.13 (07/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

I.S. EN 61249-3-5:1999 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - TRANSFER ADHESIVE FILMS
EN 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

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