EN 61249-3-5:1999

Current

Current The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

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Published date: 15-04-1999

Publisher: European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
        reference numbers
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Abstract - (Show below) - (Hide below)

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

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Committee	CLC/SR 91
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

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Equivalent Standard(s)	Relationship
IEC 61249-3-5:1999	Identical
NF EN 61249-3-5 : 2002	Identical
NBN EN 61249 3-5 : 2000	Identical
NEN EN IEC 61249-3-5 : 1999	Identical
I.S. EN 61249-3-5:1999	Identical
UNE-EN 61249-3-5:2000	Identical
PN EN 61249-3-5 : 2002	Identical
SN EN 61249-3-5 : 1999	Identical
BS EN 61249-3-5:1999	Identical
DIN EN 61249-3-5:1999-11	Identical

Standards Referencing This Book - (Show below) - (Hide below)

EN 60249-2-15 : 1994 AMD 1 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY
EN 60249-2-8 : 1994 COR 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM
IEC 60249-2-8:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
EN 60249-1 : 1993 COR 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
EN 60249-2-13 : 1994 AMD 1 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
IEC 60249-2-15:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
IEC 60249-2-13:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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