EN 60512-16-21:2012
Current
The latest, up-to-date edition.
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
29-06-2012
FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test equipment
5 Preparation of the specimens
6 Measurement of whisker length
7 Test method
8 Requirements
9 Information to be recorded
10 Details to be specified
Annex A (informative) - Whisker growth due to mechanical
stresses induced by assembly processes and intended
usage
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
IEC 60512-16-21:2012 The object of this standard is to define a standard test method to assess the possibility of whisker growth by external mechanical stress on the tin and tin-alloy plated parts of a connector in its application (after wire termination, after soldering, after mounting, mated with counterpart).
Committee |
SR 48B
|
DocumentType |
Test Method
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
IEC 60512-16-21:2012 | Identical |
NF EN 60512-16-21 : 2012 | Identical |
NBN EN 60512-16-21 : 2012 | Identical |
NEN EN IEC 60512-16-21 : 2012 | Identical |
I.S. EN 60512-16-21:2012 | Identical |
PN EN 60512-16-21 : 2013 | Identical |
VDE 0687-512-16-21 : 2012 | Identical |
DIN EN 60512-16-21 : 2012 | Identical |
UNE-EN 60512-16-21:2012 | Identical |
BS EN 60512-16-21:2012 | Identical |
CEI EN 60512-16-21 : 2013 | Identical |
PNE-FprEN 60512-16-21 | Identical |
BS EN 60664-3:2017 | Identical |
IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
EN 60512-1:2001 | Connectors for electronic equipment - Tests and measurements - Part 1: General |
EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
IEC 60512-1:2001 | Connectors for electronic equipment - Tests and measurements - Part 1: General |
IEC 60050-581:2008 | International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment |
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