EN 60749-42:2014
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
03-10-2014
FOREWORD
1 Scope
2 Normative references
3 Test equipment
4 Procedure
5 Failure criteria
6 Information to be given in applicable
procurement document
Annex ZA (normative) - Normative references to international
Publications with their corresponding European
publications
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| PN EN 60749-42 : 2014 | Identical |
| UNE-EN 60749-42:2014 | Identical |
| SN EN 60749-42:2014 | Identical |
| CEI EN 60749-42 : 2016 | Identical |
| I.S. EN 60749-42:2014 | Identical |
| NBN EN 60749-42 : 2014 | Identical |
| BS EN 60749-42:2014 | Identical |
| NF EN 60749-42 : 2015 | Identical |
| NEN EN IEC 60749-42 : 2014 | Identical |
| DIN EN 60749-42:2015-05 | Identical |
| IEC 60749-42:2014 | Identical |
| PNE-FprEN 60749-42 | Identical |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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