IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60749-28:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level |
EN 60749-23:2004/A1:2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE |
EN 60749-15:2010/AC:2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
IEC 60749-21:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
IEC 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
IEC 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
IEC 60749-29:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
EN 60749-42:2014
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Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage |
IEC 60749-11:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
EN 60749-29:2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST |
EN 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
IEC Q 01 : 5.0
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES |
EN 60749-21:2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
IEC 60749-15:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
IEC 60749-26:2013
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
IEC 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
EN 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
IEC 60749-42:2014
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Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage |
EN 60749-26:2014
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
EN 60749-20:2009
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60068-2-1:2007
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Environmental testing - Part 2-1: Tests - Test A: Cold |
EN 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
IEC 60749-23:2004+AMD1:2011 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
IEC 60068-2-30:2005
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Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
EN 60749-28:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level |