EN 60749-9:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
16-06-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography
IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.This edition includes the following significant technical changes with respect to the previous edition:a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;b) additional variant – ‘adhesive tape pull test’.
Committee |
CLC/TC 47X
|
DevelopmentNote |
Supersedes EN 60749. (06/2017)
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Supersedes |
Standards | Relationship |
IEC 60749-9:2017 | Identical |
NF EN 60749-9 : 2002 | Identical |
UNE-EN 60749-9:2003 | Identical |
NBN EN 60749-9 : 2003 | Identical |
NEN EN IEC 60749-9 : 2017 | Identical |
I.S. EN 60749-9:2017 | Identical |
PN EN 60749-9 : 2017 | Identical |
UNE-EN 60749-9:2017 | Identical |
NF EN 60749-9:2017 | Identical |
BS EN 60749-9:2002 | Identical |
CEI EN 60749-9 : 2004 | Identical |
DIN EN 60749-9:2016-09 (Draft) | Identical |
PNE-prEN 60749-9:2016 | Identical |
BS EN 60749-9:2017 | Identical |
IEC 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
FED-STD-101 Revision C:1980 | TEST PROCEDURES FOR PACKAGING MATERIALS |
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