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EN 60749-9:2017

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Published date

16-06-2017

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography

IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.This edition includes the following significant technical changes with respect to the previous edition:a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;b) additional variant – ‘adhesive tape pull test’.

Committee
CLC/TC 47X
DevelopmentNote
Supersedes EN 60749. (06/2017)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

IEC 61340-2-3:2016 Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation
FED-STD-101 Revision C:1980 TEST PROCEDURES FOR PACKAGING MATERIALS

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