• EN 60749 : 99 AMD 2 2001

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS

    Available format(s): 

    Superseded date:  01-06-2003

    Language(s): 

    Published date:  12-01-2013

    Publisher:  European Committee for Standards - Electrical

    Pure ENs are not available for sale, please purchase a suitable national adoption

    Sorry this product is not available in your region.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Chapter 1: General
    1 Scope and object
    2 Normative references
    3 Terms, definitions and letter symbols
    4 Standard atmospheric conditions
    5 External visual examination and verification of dimensions
    6 Electrical measurements
    Chapter 2: Mechanical test methods
    1 Robustness of terminations
       1.1 Tensile
       1.2 Bending
       1.3 Torsion
       1.4 Torque
    2 Soldering
       2.1 Solderability
       2.2 Resistance to soldering heat
       2.3 Resistance of plastic encapsulated SMDs to the
            combined effect of moisture and soldering heat
    3 Vibration (sinusoidal)
    4 Shock
    5 Acceleration, steady state
    6 Bond strength test
       6.1 General
       6.2 Methods A and B
       6.3 Method C
       6.4 Method D
       6.5 Methods E and F
       6.6 Method G: Wire ball shear test
       6.7 Information to be given in the relevant specification
    7 Die shear strength test
       7.1 Object
       7.2 Description of the test apparatus
       7.3 Test method
       7.4 Failure criteria
       7.5 Requirements
       7.6 Information to be given in the relevant
            specification
    Chapter 3: Climatic Test Methods
    1 Change of temperature
       1.1 Rapid change of temperature: two-chamber method
       1.2 Rapid change of temperature: two-fluid-bath method
    2 Storage (at high temperature)
    3 Low air pressure
    4A Damp heat, steady state
    4B Damp heat, steady state, accelerated
    4C Damp heat, steady state, highly accelerated
    5 Sealing
       5.1 General terms
       5.2 Bomb pressure test
       5.3 Fine leak detection: radioactive krypton method
       5.4 Fine leak detection: tracer gas method with mass spectrometer
       5.5 Gross leak, perfluorocarbon vapour method using electronic
            detection apparatus
       5.6 Gross leak - perfluorocarbon - bubble detection method
       5.7 Test condition E, weight-gain gross-leak detection
       5.8 Penetrant dye gross leak detection
       5.9 Gross leak re-tests
    6 Salt mist
    7 Thermal intermittence test
    8 Internal moisture content measurement by mass
       spectrometry method
       8.1 Object
       8.2 General description
       8.3 Test apparatus
       8.4 Preconditioning
       8.5 Conditioning
       8.6 Requirements
       8.7 Information to be given in the relevant specification
       8.8 Guidance
    Chapter 4: Miscellaneous Test Methods
    1 Flammability tests of plastic-encapsulated devices
       1.1 Flammability (internally induced)
       1.2 Flammability (externally induced)
    2 Permanence of marking
    Annex A (normative) Guidance
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Defines test methods to semiconductor devices (discrete devices and integrated circuits) from which a selection may be made. Additional test methods may be required for non-cavity devices.

    General Product Information - (Show below) - (Hide below)

    Committee SR 47
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61643-321 : 2002 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATIONS FOR AVALANCHE BREAKDOWN DIODE (ABD)
    BS EN 61192-4 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    BS EN 61643-341 : 2001 LOW VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATION FOR THYRISTOR SURGE SUPPRESSORS (TSS)
    CEI EN 61643-341 : 2002 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 341: SPECIFICATION FOR THYRISTOR SURGE SUPPRESSOR (TSS)
    CEI EN 61643-321 : 2003 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 321: SPECIFICATIONS FOR AVALANCHE BREAKDOWN DIODE (ABD)
    CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    EN 61643-341 : 2001 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATION FOR THYRISTOR SUPPRESSORS (TSS)
    EN 61643-321 : 2002 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATIONS FOR AVALANCHE BREAKDOWN DIODE (ABD)
    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60653:1979 General considerations on ultrasonic cleaning
    HD 323.2.11 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST KA: SALT MIST
    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    HD 323.2.13 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST M: LOW AIR PRESSURE
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
    EN 60068-1:2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
    HD 323.2.14 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST N: OF TEMPERATURE
    EN 60068-2-7 : 1993 ENVIRONMENTAL TESTING - TESTS - TEST GA AND GUIDANCE: ACCELERATION, STEADY STATE
    HD 323.2.48 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON THE APPLICATION OF THE TESTS OF IEC PUBLICATION 68 TO SIMULATE THE EFFECTS OF STORAGE
    HD 323.2.3 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
    IEC 60068-2-47:2005 Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    EN 60068-2-17 : 1994 BASIC ENVIRONMENTAL TESTING - TEST Q: SEALING
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    EN 60068-2-21:2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    EN 60068-2-6:2008 ENVIRONMENTAL TESTING - PART 2-6: TESTS - TEST FC: VIBRATION (SINUSOIDAL)
    IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
    IEC 60068-2-48:1982 Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
    EN 60695-2-2:1994/A1:1995 FIRE HAZARD TESTING - TEST METHODS - NEEDLE-FLAME TEST
    EN 60068-2-47:2005 ENVIRONMENTAL TESTING - PART 2-47: TESTS - MOUNTING OF SPECIMENS FOR VIBRATION, IMPACT AND SIMILAR DYNAMIC TESTS
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective