EN 61188-1-1:1997

Withdrawn

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Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

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Withdrawn date: 30-06-1998

Language(s):

Published date: 16-10-1997

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative reference
3 Basic requirements
   3.1 Design
   3.2 Rigid board manufacturer
   3.3 Assembly
   3.4 Use
4 Deviations from flatness - rigid copper-clad
   base material
   4.1 Causes
   4.2 Prevention and correction
   4.3 Test methods and requirements
5 Deviations from flatness - unassembled rigid
   printed boards
   5.1 Causes
   5.2 Prevention
   5.3 Ratification
   5.4 Requirements for flatness
   5.5 Measurement methods
6 Deviations from flatness - rigid printed board
   assemblies
   6.1 Causes
   6.2 Prevention
   6.3 Correction
7 Problems associated with placement of surface-mounted
   components
   7.1 Placement of components (assembly)
   7.2 Requirements for 'pick-and-place' machines
8 Deviations from flatness in service
9 Prevention summary
10 Corrective action summary
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Abstract - (Show below) - (Hide below)

Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.

General Product Information - (Show below) - (Hide below)

Committee	CLC/SR 91
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Withdrawn

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
NF EN 61188 1-1 : 1998	Identical
IEC 61188-1-1:1997	Identical
NBN EN 61188 1-1 : 1998	Identical
NEN EN IEC 61188-1-1 : 1997	Identical
I.S. EN 61188-1-1:1999	Identical
PN EN 61188-1-1 : 2002	Identical
SN EN 61188-1-1 : 1997	Identical
UNE-EN 61188-1-1:1997	Identical
BS EN 61188-1-1:1997	Identical
CEI EN 61188-1-1 : 2001	Identical
DIN EN 61188-1-1:1998-03	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies General
BS EN 61188-5-1:2002	Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 61191-1:2013	Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
I.S. EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
I.S. EN 61188-5-1:2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General

Standards Referencing This Book - (Show below) - (Hide below)

IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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