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    I.S. EN 61188-1-1:1999

    Current The latest, up-to-date edition.

    PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1999

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative reference
    3 Basic requirements
       3.1 Design
       3.2 Rigid board manufacturer
       3.3 Assembly
       3.4 Use
    4 Deviations from flatness - rigid copper-clad
       base material
       4.1 Causes
       4.2 Prevention and correction
       4.3 Test methods and requirements
    5 Deviations from flatness - unassembled rigid
       printed boards
       5.1 Causes
       5.2 Prevention
       5.3 Ratification
       5.4 Requirements for flatness
       5.5 Measurement methods
    6 Deviations from flatness - rigid printed board
       assemblies
       6.1 Causes
       6.2 Prevention
       6.3 Correction
    7 Problems associated with placement of surface-mounted
       components
       7.1 Placement of components (assembly)
       7.2 Requirements for 'pick-and-place' machines
    8 Deviations from flatness in service
    9 Prevention summary
    10 Corrective action summary
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Specifies those factors which control the flatness of rigid printed boards and their assemblies.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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