Skip to content
Please enter a keyword to search

  • IEC 61188-1-1:1997

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  12-09-2022

    Language(s):  English - French

    Published date:  26-08-1997

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative reference
    3 Basic requirements
        3.1 Design
        3.2 Rigid board manufacture
        3.3 Assembly
        3.4 Use
    4 Deviations from flatness - rigid copper-clad base
        material
        4.1 Causes
        4.2 Prevention and correction
        4.3 Test methods and requirements
    5 Deviations from flatness - Unassembled rigid
        printed boards
        5.1 Causes
        5.2 Prevention
        5.3 Rectification
        5.4 Requirements for flatness
        5.5 Measurement methods
    6 Deviations from flatness - Rigid printed board
        assemblies
        6.1 Causes
        6.2 Prevention
        6.3 Correction
    7 Problems associated with placement of surface-mounted
        components
        7.1 Placement of components (assembly)
        7.2 Requirements for 'pick-and-place' machines
    8 Deviations from flatness in service
    9 Prevention summary
    10 Corrective action summary

    Abstract - (Show below) - (Hide below)

    Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Also numbered as BS EN 61188-1.1 (11/2005) Stability Date: 2017. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
    BS EN 61188-5-1:2002 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    BS EN 62326-4:1997 Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
    I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective